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Manager, IC Packaging Development, India

Reference 32124s  (Please mention Stopdodo/Environment Jobs in your application)
Salary Additional Information $100,000 + depending on candidate's experience
Type Fixed Term and Permanent Roles
Status Full Time
Level Mid Level
Deadline 09/07/2010
Company Name Selby Jennings
Contact Name Environmental Team
Telephone 02070194100
Email environmental@selbyjennings-solutions.com
Website Further Details / Applications
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My client is one of the leading global technology companies with a remit for high growth in 2010 and the following 3 years. They are currently looking to hire a Manager or Deputy Manager for a role in their IC Packaging Development group. This is a role with lots of responsibility attached so they are looking for someone with very strong development and also leadership experience who will be able to push their projects forward.

Responsibilities will include, but not be restricted to:

  • Take full responsibility for all IC packaging activities
  • Be responsible for the designing and manufacturing of packaged chip on board systems containing multiple ICs and stacked FLASH memory dies
  • Come up with new concepts and specifications for new multi-chip packages for dense, high speed applications to meet industry and customer quality standards
  • With team members, decide on materials for die attach, encapsulation, adhesive, and solder paste to achieve the desired mechanical, electrical, thermal, and reliability requirements
  • Thermal modelling, analysis and testing of multi-chip packages
  • Develop mechanical strength in the Flash memory drives
  • Develop good relationships with high quality vendor manufacturing contacts in the market
  • Coordinate prototype builds and develop ultimate reduction level manufacturing process flow including die attach, wire- bonding, encapsulation, solder bumping, package stacking, and heat sink attach (if required)
  • Assist in test development (test fixtures, programs, analysis, debug) at chip package level
  • Deal with procurement of materials when necessary

Experience and qualifications:

  • Experience of using package characterization techniques and DOE methodology
  • Experience of wire bond assembly
  • Minimum 5 years of experience in high speed IC packaging
  • EDEC and IPC requirements for electronic packaging
  • Proven track record of Package Interconnect Technologies and advanced packaging technologies including CSP, QFN, BGA, MCM/MCP, and Package Stacking
  • Understand solder joint reliability
  • Proficient in AutoCAD or equivalent
  • Working knowledge  in package level test, data collection, FA and debug
  • Experience working in high volume semiconductor manufacturing environment
  • Outstanding communication and teamwork skills

For more information please send a Word copy of your CV to the Environmental team on environmental@selbyjennings-solutions.com, call us on 00 44 207 019 4140, or visit www.selbyjennings-solutions.com.  No PDFs please. We can only respond to applicants with relevant experience

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