Title: Creep in Photovoltaic Modules: Examining the Stability of Polymeric Materials and Components.
Author: Miller, D. C.; Kempe, M. D.; Glick, S. H.; Kurtz, S. R.
Pages/Volumes: 9 pp.
Publication Year: 2011
Notes: 35th IEEE Photovoltaic Specialists Conference (PVSC '10), June 20-25, 2010, Honolulu, Hawaii
Document Type: Conference Paper
NTIS/GPO Number: 1007336
Subject Code Description: Solar Energy - Photovoltaics
Abstract: Interest in renewable energy has motivated the implementation of new polymeric materials in photovoltaic modules. Some of these are non-cross-linked thermoplastics, in which there is a potential for new behaviors to occur, including phase transformation and visco-elastic flow. Differential scanning calorimetry and rheometry data were obtained and then combined with existing site-specific time-temperature information in a theoretical analysis to estimate the displacement expected to occur during module service life. The analysis identified that, depending on the installation location, module configuration and/or mounting configuration, some of the thermoplastics are expected to undergo unacceptable physical displacement. While the examples here focus on encapsulation materials, the concerns apply equally to the frame, junction-box, and mounting-adhesive technologies.
Accession Number: 47718
Library Notes: NPL-1102 REV
Report Numbers: CP-5200-47718
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